US Patent Issued on Aug. 25 for "Solder paste, method for forming solder bumps, and method for manufacturing member provided with solder bumps" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,203, issued on Aug. 25.

"Solder paste, method for forming solder bumps, and method for manufacturing member provided with solder bumps" was invented by Yoshinori Ejiri (Tokyo), Shinichirou Sukata (Tokyo), Kunihiko Akai (Tokyo), Masumi Sakamoto (Tokyo), Chiaki Shimizu (Tokyo), Junichi Kakehata (Tokyo) and Ayumi Yoshiba (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for forming solder bumps by using a solder paste containing solder particles and a volatile dispersion medium, the method including: applying a solder paste on a member having a plurality of electrodes on the surface; heating the member and the solder paste at a temperature...