ALEXANDRIA, Va., Aug. 18 -- United States Patent no. D1,143,053, issued on Aug. 18.
"Cupping device" was invented by Liancong Chen (Guangzhou, China).
The patent was filed on May 28, 2024, under Application No. D/944,366.
*For further information, including images, charts and tables, please visit: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=1&f=G&l=50&co1=AND&d=PTXT&s1=D1143053&OS=D1143053&RS=D1143053
Disclaimer: Curated by HT Syndication....