ALEXANDRIA, Va., April 7 -- United States Patent no. 12,597,739, issued on April 7.

"High-frequency high-speed transmission cable module and upper cover of the cover body thereof" was invented by James Cheng Lee (La Habra, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An upper cover of a cover body of a high-frequency high-speed transmission cable module is provided, including a main body and a heat dissipation block. Two end portions in the length direction of the main body are respectively defined as a first end portion and a second end portion, and the first end portion is provided with a through hole. The heat dissipation block is embedded in the through hole and exposed on the top surface of the...