US Patent Issued on April 21 for "Semiconductor manufacturing equipment" (South Korean Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,605,784, issued on April 21.

"Semiconductor manufacturing equipment" was invented by Cheolan Kwon (Suwon-si, South Korea) and Jingyu Moon (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Semiconductor manufacturing equipment including a main body having a bonding head, a head heater at a bottom of the bonding head, the head heater including a thermal compression surface, negative pressure channels recessed from the thermal compression surface and the negative pressure channels including holes therein, and a bonding tool having a first surface, a second surface, grooves at the first surface, the first surface configured to contact t...