GENEVA, April 7 -- ZEON CORPORATION (6-2, Marunouchi 1-chome, Chiyoda-ku, Tokyo1008246), 日本ゼオン株式会社 (東京都千代田区丸の内一丁目６番２号) filed a patent application (PCT/JP2025/034479) for "WATER-CONTAINING BONDING MATERIAL, RAW MATERIAL SOLUTION FOR FORMING WATER-CONTAINING BONDING MATERIAL, BONDING MEMBER, AND BONDING STRUCTURE" on Sep 29, 2025. With publication no. WO/2026/071187, the details related to the patent application was published on Apr 02, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed...