INTERNATIONAL PATENT: YIELD ENGINEERING SYSTEMS, INC. FILES APPLICATION FOR "DEVICE BONDING"

GENEVA, April 29 -- YIELD ENGINEERING SYSTEMS, INC. (3178 Laurelview CourtFremont, California 94538) filed a patent application (PCT/US2025/051519) for "DEVICE BONDING" on Oct 17, 2025. With publication no. WO/2026/085474, the details related to the patent application was published on Apr 23, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): ALAPATI, Ramakanth (3178 Laurelview CourtFremont, California 94538), CHADDA, Saket (3178 Laurelview CourtFremont, California 94538), MAITY, Nirmalya (3178 Laurelview CourtFremont, California 94538), KARIM, M Ziaul (3178 Laurelview CourtFremont, California ...