INTERNATIONAL PATENT: YFYJUPITER US, INC., YFY JUPITER LIMITED FILES APPLICATION FOR "WAVE PACKAGING ASSEMBLY, CUSHION ASSEMBLY AND PADDING ARTICLE"

GENEVA, April 27 -- YFYJUPITER US, INC. (1320 TOWER ROAD, SCHAUMBURG, IL 60173 COOK,), YFY JUPITER LIMITED (FLAT/RM 01-02, 15/F, YEN SHENG CENTRE, 64 HOI YUEN ROAD, KWUN TONG, KOWLOON,Hong Kong) filed a patent application (PCT/CN2025/125608) for "WAVE PACKAGING ASSEMBLY, CUSHION ASSEMBLY AND PADDING ARTICLE" on Sep 30, 2025. With publication no. WO/2026/081872, the details related to the patent application was published on Apr 23, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): SMITH, Scott (1320 TOWER ROAD, SCHAUMBURG, IL 60173 COOK,), QUEVEDO, Luis (CL Tacotalpa 1639 Norte Villahermosa CP....