GENEVA, March 10 -- YAMAHA ROBOTICS CO., LTD. (51-1, Inadaira 2-Chome, Musashimurayama-Shi, Tokyo2088585), ヤマハロボティクス株式会社 (東京都武蔵村山市伊奈平２丁目５１番地の１) filed a patent application (PCT/JP2025/030041) for "RESIN SEALING DEVICE" on Aug 27, 2025. With publication no. WO/2026/048842, the details related to the patent application was published on Mar 05, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organizatio...