GENEVA, April 7 -- YAMAHA ROBOTICS CO., LTD. (51-1, Inadaira 2-chome, Musashimurayama-shi, Tokyo2088585), ヤマハロボティクス株式会社 (東京都武蔵村山市伊奈平二丁目５１番地の１) filed a patent application (PCT/JP2025/033909) for "BONDING DEVICE" on Sep 25, 2025. With publication no. WO/2026/070999, the details related to the patent application was published on Apr 02, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO...