INTERNATIONAL PATENT: XSCAPE PHOTONICS INC. FILES APPLICATION FOR "INTEGRATED CIRCUIT MODULE WITH RELEASABLY ATTACHED LASER PACKAGE"

GENEVA, Feb. 24 -- XSCAPE PHOTONICS INC. (400 Kelby St., Suite 1611Fort Lee, New Jersey 07024) filed a patent application (PCT/US2025/041879) for "INTEGRATED CIRCUIT MODULE WITH RELEASABLY ATTACHED LASER PACKAGE" on Aug 13, 2025. With publication no. WO/2026/039568, the details related to the patent application was published on Feb 19, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): RAGHUNATHAN, Vivek (400 Kelby St., Suite 1611Fort Lee, New Jersey 07024), LI, Li (701 Evans Creek CourtSan Ramon, California 94582), GHAEMI, Allan (19 Maple StreetEdgewater, California 07020), MENDOZA, Ferdinand ...