INTERNATIONAL PATENT: XPEEDIC CO., LTD., 芯和半导体科技（上海）股份有限公司 FILES APPLICATION FOR "RAPID ANALYSIS METHOD AND APPARATUS FOR POWER INTEGRITY BASED ON GRID CUTTING"

GENEVA, May 17 -- XPEEDIC CO., LTD. (Room 01, 4th Floor, No. 5, Lane 60, Naxian RoadPudong New Area, Shanghai 201200), 芯和半导体科技（上海）股份有限公司 (中国上海市浦东新区纳贤路60弄5号4层01室) filed a patent application (PCT/CN2025/113837) for "RAPID ANALYSIS METHOD AND APPARATUS FOR POWER INTEGRITY BASED ON GRID CUTTING" on Aug 11, 2025. With publication no. WO/2026/097982, the details related to the patent application was published on May 15, 2026.

Notably, the patent application was submitted under the International Patent Classification (I...