GENEVA, March 8 -- WUXI SHENNAN CIRCUITS CO., LTD. (No.18 Changjiang East Road, Xinwu DistrictWuxi, Jiangsu 214000), 无锡深南电路有限公司 (中国江苏省无锡市新吴区长江东路18号) filed a patent application (PCT/CN2024/132995) for "HIGH-HEAT-DISSIPATION COPPER SUBSTRATE AND MANUFACTURING METHOD THEREFOR" on Nov 19, 2024. With publication no. WO/2026/044947, the details related to the patent application was published on Mar 05, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Org...