INTERNATIONAL PATENT: WOLFSPEED, INC. FILES APPLICATION FOR "SYSTEM TO REDUCE INDUCED SUBSURFACE DAMAGE IN SEPARATION OF SEMICONDUCTOR WORKPIECES"

GENEVA, March 24 -- WOLFSPEED, INC. (4600 Silicon DriveDurham, North Carolina 27703) filed a patent application (PCT/US2025/045902) for "SYSTEM TO REDUCE INDUCED SUBSURFACE DAMAGE IN SEPARATION OF SEMICONDUCTOR WORKPIECES" on Sep 11, 2025. With publication no. WO/2026/060085, the details related to the patent application was published on Mar 19, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): BUBEL, Simon (c/o Wolfspeed, Inc.4600 Silicon DriveDurham, North Carolina 27703)

Abstract: Methods and systems for processing semiconductor workpieces are provided. In one example, a system includes on...