GENEVA, June 24 -- KYOCERA CORPORATION filed a patent application (JP2025/040877) for “WIRING BOARD, PACKAGE FOR STORING ELECTRONIC COMPONENT, BRAZING FILLER METAL, AND METHOD FOR MANUFACTURING WIRING BOARD”. With publication no. WO/2026/116279, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H05K 1/09
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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