GENEVA, July 27 -- SAMSUNG ELECTRONICS CO., LTD. filed a patent application (IB2026/050327) for “WI-FI SCANNING FOR GEOFENCING AND SUB-LOCATION IDENTIFICATION AND RECOGNITION”. With publication no. WO/2026/154388, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H04W 8/00
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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