International Patent: WET WIPE STACKING STRUCTURE, WET WIPE PACKAGING PACK THEREOF, INDIVIDUAL WET WIPE PULL-OUT SHEET FOR WET WIPE PACKAGING PACK, AND DEDICATED PRESSING DEVICE FOR WET WIPE PACKAGING PACK

GENEVA, Aug. 21 -- LEE, Si Hong filed a patent application (KR2026/002643) for “WET WIPE STACKING STRUCTURE, WET WIPE PACKAGING PACK THEREOF, INDIVIDUAL WET WIPE PULL-OUT SHEET FOR WET WIPE PACKAGING PACK, AND DEDICATED PRESSING DEVICE FOR WET WIPE PACKAGING PACK”. With publication no. WO/2026/173430, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: A47K 10/42

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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