International Patent: WEARABLE PATTERNED NANOCOMPOSITE CIRCUITS FOR TEMPERATURE COMPENSATED STRAIN SENSING

GENEVA, Aug. 14 -- THE REGENTS OF THE UNIVERSITY OF CALIFORNIA filed a patent application (US2026/014769) for “WEARABLE PATTERNED NANOCOMPOSITE CIRCUITS FOR TEMPERATURE COMPENSATED STRAIN SENSING”. With publication no. WO/2026/170210, here are the other details related to the patent application:

Kind: Initial Publication without ISR [A2]

IPC: A61B 5/11

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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