INTERNATIONAL PATENT: WANG, CHIA-SHOU, 王家寿 FILES APPLICATION FOR "SEAMLESS CONNECTION STRUCTURE FOR PARTITION PLATES"

GENEVA, March 15 -- WANG, Chia-shou (18F.-5, No. 137, Sec. 1, Zhongzheng E. Rd., Tamsui Dist., New Taipei CityTaiwan 251), 王家寿 (中国台湾省新北市淡水区中正东路1段137号18楼之5) filed a patent application (PCT/CN2024/116886) for "SEAMLESS CONNECTION STRUCTURE FOR PARTITION PLATES" on Sep 04, 2024. With publication no. WO/2026/050931, the details related to the patent application was published on Mar 12, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): WANG, Chia-...