International Patent: WAFER-SCALE THREE-DIMENSIONAL HETEROGENEOUS INTEGRATION FOR ZETTA-SCALE ALL-SILICON COMPUTING

GENEVA, July 6 -- SILVERBROOK, Kia filed a patent application (IB2025/063505) for “WAFER-SCALE THREE-DIMENSIONAL HETEROGENEOUS INTEGRATION FOR ZETTA-SCALE ALL-SILICON COMPUTING”. With publication no. WO/2026/139936, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H10D 88/00

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Disclaimer: Curated by HT Syndication....