International Patent: WAFER PROTECTIVE FILM FORMING METHOD AND WAFER GRINDING DEVICE

GENEVA, July 6 -- TAKATORI CORPORATION filed a patent application (JP2025/045205) for “WAFER PROTECTIVE FILM FORMING METHOD AND WAFER GRINDING DEVICE”. With publication no. WO/2026/141438, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H10P 52/00

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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