International Patent: WAFER-LIKE SENSOR CONFIGURED FOR SENSOR MEASUREMENTS IN HIGH-TEMPERATURE ENVIRONMENTS IMPLEMENTING SENSOR CIRCUITS AND/OR SENSOR PROCESSING AND A PROCESS OF IMPLEMENTING THE SAME

GENEVA, July 9 -- NORDSON TEST AND INSPECTION AMERICAS, INC. filed a patent application (US2025/056788) for “WAFER-LIKE SENSOR CONFIGURED FOR SENSOR MEASUREMENTS IN HIGH-TEMPERATURE ENVIRONMENTS IMPLEMENTING SENSOR CIRCUITS AND/OR SENSOR PROCESSING AND A PROCESS OF IMPLEMENTING THE SAME”. With publication no. WO/2026/112555, here are the other details related to the patent application:

Kind: Later publication of international search report [A3]

IPC: G01K 1/02

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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