International Patent: WAFER LEVEL PACKAGE, WAFER LEVEL-CHIP SIZE PACKAGE, AND METHOD FOR MANUFACTURING SAME

GENEVA, July 2 -- MURATA MANUFACTURING CO., LTD. filed a patent application (JP2025/040383) for “WAFER LEVEL PACKAGE, WAFER LEVEL-CHIP SIZE PACKAGE, AND METHOD FOR MANUFACTURING SAME”. With publication no. WO/2026/133837, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H10W 76/01

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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