GENEVA, July 18 -- CHIPMORE TECHNOLOGY CORPORATION LIMITED filed a patent application (CN2025/120630) for “WAFER EDGE BEAD REMOVAL DEVICE AND EDGE BEAD REMOVAL METHOD”. With publication no. WO/2026/148899, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H01L 21/67
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Disclaimer: Curated by HT Syndication....