GENEVA, July 18 -- SONY SEMICONDUCTOR SOLUTIONS CORPORATION filed a patent application (JP2025/040998) for “WAFER, METHOD FOR MANUFACTURING OPTICAL MEMBER, AND MOLD”. With publication no. WO/2026/150686, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: G02B 3/00
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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