GENEVA, Sept. 7 -- AAC MICROTECH (CHANGZHOU) CO., LTD. filed a patent application (CN2025/079023) for “VIBRATION HEAT DISSIPATION PUMP, HEAT DISSIPATION STRUCTURE AND HEAT DISSIPATION PUMP CONTROL METHOD”. With publication no. WO/2026/178693, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: F04B 17/04
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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