GENEVA, Aug. 14 -- R.P. SCHERER TECHNOLOGIES, LLC filed a patent application (US2026/014725) for “VACUUM ROTARY DIE ENCAPSULATION SYSTEM AND PROCESS FOR MANUFACTURING CAPSULES”. With publication no. WO/2026/170187, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: A61J 3/07
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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