International Patent: VACUUM REFLOW SOLDERING HAVING OVEN UNIT CONNECTED IN SERIES FOR EACH TEMPERATURE SECTION

GENEVA, Oct. 5 -- KO, Hyung Rae filed a patent application (KR2026/004541) for “VACUUM REFLOW SOLDERING HAVING OVEN UNIT CONNECTED IN SERIES FOR EACH TEMPERATURE SECTION”. With publication no. WO/2026/205904, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H05K 3/3494

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Disclaimer: Curated by HT Syndication....