INTERNATIONAL PATENT: UNIVERSAL INSTRUMENTS CORPORATION FILES APPLICATION FOR "LASER-ASSISTED HYBRID BONDING SYSTEM AND METHOD"

GENEVA, March 11 -- UNIVERSAL INSTRUMENTS CORPORATION (33 Broome Corporate ParkwayConklin, New York 13748) filed a patent application (PCT/US2025/043428) for "LASER-ASSISTED HYBRID BONDING SYSTEM AND METHOD" on Aug 26, 2025. With publication no. WO/2026/050189, the details related to the patent application was published on Mar 05, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): GIESKES, Koenraad Alexander (48 Hanson RoadDeposit, New York 13754)

Abstract: An electronic device placement system includes a positioning system having a carriage movable between a picking location and a placement l...