International Patent: UNDERFILL MATERIAL, SEMICONDUCTOR PACKAGE, AND PRODUCTION METHOD FOR SEMICONDUCTOR PACKAGE

GENEVA, Sept. 18 -- RESONAC CORPORATION filed a patent application (JP2025/008047) for “UNDERFILL MATERIAL, SEMICONDUCTOR PACKAGE, AND PRODUCTION METHOD FOR SEMICONDUCTOR PACKAGE”. With publication no. WO/2026/186030, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H01L 23/29

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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