International Patent: ULTRASONIC SHEAR-WAVE IMAGING FOR WHEN THICKNESS MATTERS

GENEVA, Oct. 22 -- DARKVISION TECHNOLOGIES INC. filed a patent application (IB2026/053779) for “ULTRASONIC SHEAR-WAVE IMAGING FOR WHEN THICKNESS MATTERS”. With publication no. WO/2026/220360, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: G01S 15/89

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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