International Patent: ULTRASONIC SENSOR AND PREPARATION METHOD THEREFOR, ULTRASONIC FINGERPRINT MODULE AND ELECTRONIC EQUIPMENT

GENEVA, Sept. 18 -- CHIPSEMI SEMICONDUCTOR (NINGBO) CO., LTD. filed a patent application (CN2025/099030) for “ULTRASONIC SENSOR AND PREPARATION METHOD THEREFOR, ULTRASONIC FINGERPRINT MODULE AND ELECTRONIC EQUIPMENT”. With publication no. WO/2026/183978, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H10N 30/01

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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