International Patent: UHPC HAVING NON-SHRINKAGE TO MICRO-EXPANSION DEFORMATION

GENEVA, July 6 -- SOBUTE NEW MATERIALS CO., LTD. filed a patent application (CN2025/095283) for “UHPC HAVING NON-SHRINKAGE TO MICRO-EXPANSION DEFORMATION”. With publication no. WO/2026/137676, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: C04B 28/04

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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