GENEVA, Aug. 21 -- APPLIED MATERIALS, INC. filed a patent application (US2025/049859) for “TRENCH TIP SQUARING IN SELF-ALIGNED MULTI-PATTERNING PROCESS”. With publication no. WO/2026/173641, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H10P 76/40
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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