International Patent: TRANSPARENT MULTI-LEVEL CODING AND BIT-INTERLEAVED CODED MODULATION ARCHITECTURE FOR POLAR CODES

GENEVA, June 19 -- QUALCOMM INCORPORATED filed a patent application (US2025/052023) for “TRANSPARENT MULTI-LEVEL CODING AND BIT-INTERLEAVED CODED MODULATION ARCHITECTURE FOR POLAR CODES”. With publication no. WO/2026/106770, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H04L 1/00

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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