International Patent: TRANSFER FILM, CURED MEMBRANE, SEMICONDUCTOR PACKAGE, PATTERN FORMING METHOD, AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE

GENEVA, Aug. 21 -- FUJIFILM CORPORATION filed a patent application (JP2026/001381) for “TRANSFER FILM, CURED MEMBRANE, SEMICONDUCTOR PACKAGE, PATTERN FORMING METHOD, AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE”. With publication no. WO/2026/172728, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H10P 14/68

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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