GENEVA, April 6 -- TOWA CORPORATION (5, Kamitoba Kamichoshi-cho, Minami-ku, Kyoto-shi, Kyoto6018105), ＴＯＷＡ株式会社 (京都府京都市南区上鳥羽上調子町５番地) filed a patent application (PCT/JP2025/022873) for "RESIN MATERIAL SUPPLY MECHANISM, RESIN MOLDING DEVICE, AND METHOD FOR MANUFACTURING RESIN MOLDED PRODUCT" on Jun 25, 2025. With publication no. WO/2026/069888, the details related to the patent application was published on Apr 02, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectu...