GENEVA, April 6 -- TOPPAN HOLDINGS INC. (5-1, Taito 1-chome, Taito-ku, Tokyo1100016), ＴＯＰＰＡＮホールディングス株式会社 (東京都台東区台東一丁目５番１号) filed a patent application (PCT/JP2025/027492) for "MULTILAYER WIRING BOARD, METHOD FOR MANUFACTURING MULTILAYER WIRING BOARD, AND MULTILAYER WIRING BASE BOARD" on Aug 04, 2025. With publication no. WO/2026/070029, the details related to the patent application was published on Apr 02, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) syste...