GENEVA, Aug. 21 -- SAKATA SEED CORPORATION filed a patent application (JP2026/005359) for “TOMATO PLANT RESISTANT TO LEAF MOLD AND POWDERY MILDEW”. With publication no. WO/2026/173102, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: A01H 5/00
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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