INTERNATIONAL PATENT: TOKYO ELECTRON LIMITED, TOKYO ELECTRON U.S. HOLDINGS, INC. FILES APPLICATION FOR "METHOD FOR PATTERNING SUBSTRATE USING METAL OXIDE RESIST"

GENEVA, April 14 -- TOKYO ELECTRON LIMITED (3-1 Akasaka 5-chome, Minato-kuTokyo, 107-6325), TOKYO ELECTRON U.S. HOLDINGS, INC. (401 S 1st St, Suite 900Austin, Texas 78704) filed a patent application (PCT/US2025/036179) for "METHOD FOR PATTERNING SUBSTRATE USING METAL OXIDE RESIST" on Jul 02, 2025. With publication no. WO/2026/075703, the details related to the patent application was published on Apr 09, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): DORFNER, Alec (NanoFab 300 South 255 Fuller Rd., Suite 214Albany, New York 12203)

Abstract: A method includes forming a metal-containing layer...