INTERNATIONAL PATENT: TOKYO ELECTRON LIMITED, TOKYO ELECTRON U.S. HOLDINGS, INC. FILES APPLICATION FOR "FILL SHAPE OPTIMIZATION FOR SUBSTRATE BONDING"

GENEVA, March 18 -- TOKYO ELECTRON LIMITED (3-1 Akasaka 5-chome, Minato-kuTokyo, 107-6325), TOKYO ELECTRON U.S. HOLDINGS, INC. (401 S 1st StSuite 900Austin, Texas 78704) filed a patent application (PCT/US2025/040723) for "FILL SHAPE OPTIMIZATION FOR SUBSTRATE BONDING" on Aug 05, 2025. With publication no. WO/2026/054919, the details related to the patent application was published on Mar 12, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): POWER, David (NanoFab 300 South, 255 Fuller Rd.Suite 214Albany, New York 12203), CONKLIN, David (NanoFab 300 South, 255 Fuller Rd.Suite 214Albany, New York ...