GENEVA, July 6 -- NATIONAL CENTER FOR ADVANCED PACKAGING CO., LTD filed a patent application (CN2025/099250) for “THROUGH-SILICON VIA STRUCTURE AND MANUFACTURING METHOD THEREFOR”. With publication no. WO/2026/137706, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H01L 23/48
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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