International Patent: THROUGH HOLE VIA WITH BLIND VIA FOR CABLE ATTACHMENT

GENEVA, Aug. 14 -- TERADYNE, INC. filed a patent application (US2026/013294) for “THROUGH HOLE VIA WITH BLIND VIA FOR CABLE ATTACHMENT”. With publication no. WO/2026/169532, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H05K 1/11

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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