International Patent: THREE-DIMENSIONAL SENSING-MEMORY-COMPUTING INTEGRATED CHIP AND PREPARATION METHOD AND COMPUTING METHOD THEREFOR

GENEVA, Sept. 7 -- TSINGHUA UNIVERSITY filed a patent application (CN2026/080263) for “THREE-DIMENSIONAL SENSING-MEMORY-COMPUTING INTEGRATED CHIP AND PREPARATION METHOD AND COMPUTING METHOD THEREFOR”. With publication no. WO/2026/179931, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H10D 88/00

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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