International Patent: THREE-DIMENSIONAL MEMORY DEVICE CONTAINING LATERALLY-UNDULATING LATERAL ISOLATION TRENCHES AND METHOD OF MAKING THEREOF USING AT LEAST THREE ROWS OF ISOLATION OPENINGS

GENEVA, Aug. 21 -- SANDISK TECHNOLOGIES, INC. filed a patent application (US2025/034264) for “THREE-DIMENSIONAL MEMORY DEVICE CONTAINING LATERALLY-UNDULATING LATERAL ISOLATION TRENCHES AND METHOD OF MAKING THEREOF USING AT LEAST THREE ROWS OF ISOLATION OPENINGS”. With publication no. WO/2026/173617, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H10B 43/50

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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