GENEVA, July 2 -- MICROSOFT TECHNOLOGY LICENSING, LLC filed a patent application (US2025/050768) for “THREE-DIMENSIONAL FANOUT PACKAGING STRUCTURE FOR A SYSTEM-ON CHIP AND RELATED METHODS”. With publication no. WO/2026/135793, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H10W 70/60
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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