GENEVA, July 27 -- QUALCOMM INCORPORATED filed a patent application (US2025/054169) for “THREE-DIMENSIONAL (3D) DATA AUGMENTATION”. With publication no. WO/2026/102007, here are the other details related to the patent application:
Kind: Later publication of international search report [A3]
IPC: G06T 19/00
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Disclaimer: Curated by HT Syndication....