GENEVA, July 2 -- BIOBOND ADHESIVES, INC. filed a patent application (US2025/060286) for “THICKENED STARCH-BASED ADHESIVE”. With publication no. WO/2026/136652, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: C09J 103/00
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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