GENEVA, July 1 -- RESONAC CORPORATION filed a patent application (JP2025/043225) for “THERMOSETTING RESIN COMPOSITION, PREPREG, RESIN FILM, LAMINATED PLATE, PRINTED WIRING BOARD, ANTENNA DEVICE, ANTENNA MODULE, COMMUNICATION DEVICE, METHOD FOR PRODUCING THERMOSETTING RESIN COMPOSITION, AND METHOD FOR PRODUCING PREPREG”. With publication no. WO/2026/127087, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: C08L 101/00
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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