GENEVA, Oct. 9 -- HENKEL AG & CO. KGAA filed a patent application (CN2025/086620) for “THERMALLY CONDUCTIVE SILICONE COMPOSITION AND USE THEREOF”. With publication no. WO/2026/207777, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: C09J 183/07
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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