GENEVA, July 31 -- HENKEL AG & CO. KGAA filed a patent application (CN2025/073834) for “Thermally Conductive Silicone Composition and Gap Pad Made Therefrom”. With publication no. WO/2026/156515, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: C08K 3/00
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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